超硬材料網(wǎng)

　　摘要 本文利用數(shù)學(xué)矩陣方法，建立大尺寸硅片自旋轉(zhuǎn)磨削運(yùn)動(dòng)的理論模型，研究了砂輪半徑、硅片和砂輪旋轉(zhuǎn)速度、旋轉(zhuǎn)方向等因素的選擇及各因素對(duì)磨削軌跡的影響，同時(shí)還研究了磨粒合成運(yùn)動(dòng)速度的變化規(guī)律。研究結(jié)果表明，隨著砂輪半徑的增大，磨削軌跡的曲率減小，選用較小直徑砂輪將更有利硅片表面質(zhì)量的提高。當(dāng)轉(zhuǎn)速比i大于零，隨著i值的增大，磨削軌跡的曲率逐漸減小。在轉(zhuǎn)速比i小于零的情形，當(dāng)轉(zhuǎn)速比i=-2時(shí)，磨削軌跡曲率為O，磨削軌跡的形狀接近一條直線。磨粒合成運(yùn)動(dòng)速度隨砂輪轉(zhuǎn)速和硅片轉(zhuǎn)速的增大而增大。(金剛石與磨料磨具工程2009年第五期)
　　
　　Abstract By use of matrix method，the mathematical model of grinding marks on large size wafer self-rotating grinding is developed．With the developed model，the selection principles of the factors which include the radius of the diamond wheel，the rotating speed，the rotation direction of the silicon wafer and diamond wheel，and the relationships between grinding marks and those factors are discussed．The rules of resultant motion speed of abrasive grains are also studied．The results show that the curvature of the grinding marks will get less curved as the radius of the diamond wheel increases．A smaller diamond wheel will be better for the improvement of the surface quality of the silicon wafer．When the speed ratio i is positive，the grinding marks tend to be less curved as the speed ratio i increases．In case that the speed ratio i is negative，the curvature of the grinding mark is about 0 and the grinding mark is approximately a line when the speed ratio i is-2.The resultant motion speed of the abrasive grains goes up as the rotating speed of the diamond wheel and the wafer increases．